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Sectors: Innovation, New technologies, Research

Beneficiaries: Administrations States, Corporations, SMEs, Universities

Regions: Worldwide

Category: Call for proposals

References:

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Additional info regions:

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Amount:

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Responsible: European Commission

Useful:

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Contact:

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Advice:

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Amorce:

Horizon 2020 – ECSEL Joint Undertaking – IA 2 – 2020
Funds for: producing plans and arrangements or designs for new, altered or improved products, processes, methods and tools or services

Priorities and funded actions:

Objectives
* Applied research, technology development and/or method/tool and integration, testing and validation on a small-scale prototype in a laboratory or simulated environment

Priorities
* Transport & Smart Mobility
– Major Challenge 1: Developing clean, affordable and sustainable propulsion;
– Major Challenge 2: Ensuring secure connected, cooperative and automated mobility and transportation;
– Major Challenge 3: Managing interaction between humans and vehicles;
– Major Challenge 4: Implementing infrastructure and services for smart personal mobility and logist

* Health and Wellbeing
– Moving healthcare from hospitals into our homes and daily life requiring preventive and patient centric care;
– Restructuring healthcare delivery systems, from supply-driven to patient-oriented;
– Engaging individuals more actively in their own health and wellbeing;
– Ensuring affordable healthcare for the growing amount of chronic, lifestyle related diseases and an ageing population;
– Developing platforms for wearables/implants, data analytics, artificial intelligence for precision medicine and personalised healthcare and wellbeing

* Energy
– Major Challenge 1: Ensuring sustainable power generation and energy conversion;
– Major Challenge 2: Achieving efficient community energy management;
– Major Challenge 3: Reducing energy consumption

* Digital Industry
– Major Challenge 1: Developing digital twins, simulation models for the evaluation of industrial assets at all factory levels and over system or product life-cycles;
– Major Challenge 2: AI-enabled cognitive, resilient, adaptable manufacturing;
– Major challenge 3: Developing digital platforms, application development frameworks that integrate sensors/actuators and systems;
– Major Challenge 4: Human-centred manufacturing;
– Major Challenge 5: Sustainable manufacturing in a circular economy

* Digital Life
– Major Challenge 1: Ensuring safe and secure spaces;
– Major Challenge 2: Ensuring healthy and comfortable spaces;
– Major Challenge 3: Ensuring anticipating spaces;
– Major Challenge 4: Ensuring sustainable spaces

* Systems and Components: Architecture, Design and Integration
– Major Challenge 1: Managing critical, autonomous, cooperating, evolvable systems;
– Major Challenge 2: Managing Complexity;
– Major Challenge 3: Managing Diversity;
– Major Challenge 4: Managing Multiple Constraint;
– Major Challenge 5: Integrating features of various technologies and materials into miniaturised smart components;
– Major Challenge 6: Effectively integrating modules for highly demanding environments;
– Major Challenge 7: Increasing compactness and capabilities by functional and physical systems integration

* Connectivity and Interoperability
– Major Challenge 1: Strengthening the EU position on differentiated technologies and enabling it to capture higher value by moving to system/module level;
– Major Challenge 2: Autonomous interoperability translation for communication protocol, data encoding, security and information semantics;
– Major Challenge 3: Architectures and reference implementations of interoperable, secure, scalable, smart and evolvable IoT and SoS connectivity

* Safety, Security and Reliability
– Major Challenge 1: Safety, security and privacy by design;
– Major Challenge 2: Reliability and Functional Safety;
– Major Challenge 3: Secure, safe and trustable connectivity and infrastructure;
– Major Challenge 4: Privacy, data protection and human interaction

* Computing and Storage
– Increasing performance at acceptable costs;
– Making computing systems more integrated with the real world;
– Making “intelligent” machines;
– Developing new disruptive technologies

* Process Technology, Equipment, Materials and Manufacturing for Electronic Components & Systems
– Major Challenge 1: Develop advanced logic and memory technology for nanoscale integration and application-driven performance;
– Major Challenge 2: Develop Technology for Heterogeneous System-on-Chip (SoC) Integration;
– Major Challenge 3: Develop technology for Advanced Packaging and Heterogeneous System-in-Package (SiP) integration;
– Major Challenge 4: Extend world leadership in Semiconductor Equipment, Materials and Manufacturing solutions

* Long-term vision
– New computing paradigms (‘Beyond CMOS’);
– Process technology, equipment and materials;
– Systems and components: architecture, design and integration;
– Health & wellbeing;
– Energy;
– Digital Industry;
– Transport and smart mobility;
– Connectivity and interoperability;
– Data science and Artificial Intelligence

Among financed actions
* Activities with a TRL 3-4

Additional information
* This call for proposals is an open call for proposals

* Initial duration of the project : up to 3 years

* Eligibility:
– Be a consortium composed of at least three legal entities : SMEs, Companies and Universities
– Each of the three must be established in a different Member State or associated country
– All three legal entities must be independent of each other

* Actions must take place in an eligible country