DIGITAL EUROPE – DIGITAL-Chips-2023-SG-CPL Operational activities of the pilot line – 2023

Objective

To enhance existing and develop new advanced pilot lines across the Union to enable development and deployment of cutting-edge semiconductor technologies and next-generation semiconductors.

Among financed actions

• Fully Depleted Silicon on Insulator, towards 7 nm
• Leading-edge nodes below 2 nm
• Heterogeneous system integration and assembly
• Wide Bandgap semiconductors

Additional information

• This call for proposals is an open call for proposals.

TOPICS:

Forthcoming

• DIGITAL-Chips-2023-SG-CPL1: Pilot line on advanced sub 2nm leading-edge system on chip technology
• DIGITAL-Chips-2023-SG-CPL2: Pilot line on advanced Fully Depleted Silicon On Insulator technologies targeting 7nm
• DIGITAL-Chips-2023-SG-CPL-3: Pilot line on advanced Packaging and Heterogenous Integration
• DIGITAL-Chips-2023-SG-CPL-4: Pilot line on advanced semiconductor devices based on Wide Bandgap materials

• Total budget of the call: 90 million euro
• Total budget of the topic:
  • DIGITAL-Chips-2023-SG-CPL1: 40 million euro
  • DIGITAL-Chips-2023-SG-CPL2: 10 million euro
  • DIGITAL-Chips-2023-SG-CPL-3: 30 million
  • DIGITAL-Chips-2023-SG-CPL-4: 10 million euro