HORIZON EUROPE JU – Call for proposals for Set-up, integration and process development – 2024
2024-02-29
889 million euro
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Call synthesis
Call reference
HORIZON-JU-Chips-2023-RIA-CPL
Programme
Horizon Europe Framework Programme (HORIZON)
Institution
European Commission
Sectors
Business & Industry Cooperation & Development Education & Training Justice, Security, Defence Research & Innovation Services to organisations Technology & Digital
Beneficiaries
Large company (> 250 employees) Professional organisation & network Research centre & university Smes & Start-Ups (< 249 Employees)
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Call reference
HORIZON-JU-Chips-2023-RIA-CPL
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Priorities and funded actions
Objectives
To strengthen and integrate the scientific, innovation and technological capacities and facilitating collaborative links
To secure sustainability-driven global leadership and resilience of Union value chains in key technologies and industries and on developing
To accelerate the uptake of innovative solutions throughout the Union addressing climate, environmental, health, digital and other global challenges
To enhance the critical mass and scientific and technological capabilities and competences
To accelerate the green and digital transitions
To enhance the research and innovation capabilities and performance of existing and new European innovation ecosystem and economic value chains, including in start-ups and small and medium-sized enterprises (SME)
To accelerate the deployment, uptake and diffusion of innovative solutions, technologies,services and skills
To deliver environmental, energy, resource-saving, societal, circularity and productivity improvements in new products, technologies, applications and services by exploiting Union capabilities and resources
TOPICS:
Open
HORIZON-Chips-2023-RIA-CPL-1: Pilot line on advanced sub 2nm leading-edge system on chip technology
HORIZON-Chips-2023-RIA-CPL-2: Pilot line on advanced Fully Depleted Silicon On Insulator technologies targeting 7nm
HORIZON-Chips-2023-RIA-CPL-3: Pilot line on advanced Packaging and Heterogenous Integration
HORIZON-Chips-2023-RIA-CPL-4: Pilot line on advanced semiconductor devices based on Wide Bandgap materials
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